SuperBOT 9

Part No.: MPXT-SuperBOT9
High Speed Automated IC Programming System

Product Description

Description



SuperBOT 9 – High-Performance Automated IC Programming System

The SuperBOT 9 is a next-generation fully automated IC programming solution engineered for high-volume electronic production. Designed to streamline your workflow, it replaces time-consuming manual operations with a fast, precise, and reliable automated process. From chip pickup and placement to programming, removal, and packaging, every step is handled seamlessly by the SuperBOT 9—delivering unmatched efficiency, consistency, and scalability. By combining Xeltek’s industry-leading SuperPro programmers with advanced robotic automation, the SuperBOT 9 ensures optimal performance, reduced errors, and maximum throughput—making it the ideal choice for professional manufacturers who demand accuracy and productivity.

Universal IC Programmer

  • 8 SuperPro 7500N universal programmers
  • Supports 144,000+ devices with continuous updates

High Throughput

  • 2,800+ units per hour (UPH)

Vision Check

  • Precise chip placement with orientation verification prior to socket insertion
  • Vision accuracy: 0.01 mm

Devices & Packages

  • Supports: NAND, eMMC, NOR Flash, microcontrollers, and more
  • Packages: WLCSP, SOT, BGA, TSSOP, PLCC, QFN, SOIC, etc.
  • Minimum chip size: 1 × 1 mm

Supported I/O Peripherals

  • Auto Tray (load up to 25 trays)
  • Tape Out Handler (adjustable tape reel; cold or heat sealing)
  • Electric Tape-In Feeder (dual option)
  • Air Ionizer

Marking Functions

  • Laser Marker: letters, alphanumerics, and symbols
  • Label Printer: QR codes and barcodes
  • Dot ink marker

Socket Adapters

  • Xeltek provides high-performance single and 4-gang socket adapters for automated programming. Each 4-gang adapter integrates four sockets for simultaneous multi-chip programming. With eight 4-gang adapters, you can program up to 32 chips at once—boosting throughput, reducing cycle time, and minimizing labor costs. Supported packages include BGA, QFN, SOP, and TSOP, across NAND, eMMC, microcontrollers, and more.

API Support

Applications can be integrated via API protocol.

  • Hardware Security Module (HSM)
  • MES

Specifications


Chips & Package Types

  • Chip Size
    • Min: 1x1mm, Max: 25x25mm
  • Supported Devices
    • ​EPROM, Paged EPROM, Parallel & Serial EEPROM, FPGA PROM, Flash Memory (NOR & NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontrollers (MCU), and more.
  • Available Socket Adapters
    • ​PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, WLCSP, SCSP, and more.

Air Requirements

  • Required Pressure: 0.6 MPa
  • Air Consumption: 72 Liters / Min

Hardware & Operating System

  • Operating System: Windows™
  • Integrated Computer: Built-in Industrial PC
  • Programming Hardware: SuperPro 7500N
  • Remote Connectivity: LAN Remote Access Supported

Electrical Specifications

  • Voltage Input: AC 200-240V
  • Power Consumption: 2.5KVA

I/O

Manual Tray (Standard Equipment)

The SuperBOT Manual Tray is the default I/O device where operators manually replace trays once a cycle is complete. This option requires no additional automation, making it a cost-effective solution.

 

Auto Tray Device

The Automated Tray Handler feeds unprogrammed chips into the system and stacks completed trays. This high-speed tray exchanger can handle up to 25 trays at a time, reducing manual labor and improving efficiency.

 

Tape-In Device

The Automated Tape-In Feeder supports electric tape widths from 8mm to 44mm, ensuring compatibility with various chip sizes for seamless automated loading.

 

Tape-Out Device

The SuperBOT Tape-Out Device repackages programmed ICs into tape reels for production workflows. It features an adjustable rail to accommodate multiple tape sizes and supports hot and cold sealing options.

 

Tube-In Device

The High-Speed Tube-In Handler removes chips from tube packaging and supports various tube sizes. It can handle up to 8 tubes simultaneously, optimizing component feeding efficiency.

 

Tube-Out Device

The Tube-Out Repackaging System repackages chips into tubes, supporting up to 8 tubes at a time. It is designed for high-volume automated IC programming workflows.

 

Laser Marker System

The SuperBOT Fiber Laser Marking System is designed for high-precision IC marking. Integrated with Tray and Tape handlers, it supports engraving letters, numbers, and custom symbols for batch marking.

 

Ink Marker

The SuperBOT Ink Dot Marker is optimized for high-speed marking applications, adding visual identifiers to components on Tape and Tray handlers.

Note:

1. Prices and specifications are subject to change without notice.
2. EOL products will not be notified separately.
3. Product images are for reference only. Actual products may vary depending on the version or specifications.
4. Product information, specifications, and availability are subject to confirmation at the time of order.